Nimbus

Intel® Optane™ Technology:  Just 2 years back in July, 2015, the Intel and Micron announced  3D XPoint,  a non-volatile memory (NVM) technology.    Bit storage is based on a change of bulk resistance, in conjunction with a stackable cross-gridded data access array. Initial prices are less than dynamic random-access memory (DRAM) but more than flash memory, as was expected prior to release. Development of 3D XPoint began around 2012. Intel and Micron had developed other non-volatile phase-change memory (PCM) technologies previously; Mark Durcan of Micron said 3D XPoint architecture differs from previous offerings of PCM, and uses chalcogenide materials for both selector and storage parts of memory cell that are faster and more stable than traditional PCM materials like GST. But now, they have a product that uses this Innovative Technology to boost up current generation Kaby Lake systems. Its the Intel Optane Memory Modules that comes with 16GB/32GB...

GLOBALFOUNDRIES 7LP 7nm FinFET process technology platform is ideal for high-performance, power-efficient SoCs in demanding, high-volume applications. 3D FinFET transistor technology provides world-class performance, power, area and cost advantages from 7nm scaling. 7LP technology can provide more than 40% higher device performance and more than 60% lower total power compared to 14nm technologies. History: Over the past few years, companies like Samsung, TSMC, and GlobalFoundries have all jockeyed for the pole position in the highly competitive (and extremely expensive) foundry business. Even Intel, which used to march to the beat of its own drum, has gotten in on the action. As the cost of each new node has risen, the need to be first has increased as well. The first company to hit a new node tends to secure many of the most lucrative contracts. For most of the past two decades, the pure-play foundry world was dominated by TSMC, but Samsung beat its Taiwanese rival to 14...